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Product SKUs
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SYS-111E-WR
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Motherboard
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Super X13SEW-F
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Processor
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CPU
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Core Count
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Up to 52C/104T; Up to 300MB Cache
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Note
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Supports up to 300W TDP CPUs (Air Cooled)
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GPU
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Max GPU Count
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Up to 1 double-width or 2 single-width GPUs
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Supported GPU
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CPU-GPU Interconnect
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PCIe 5.0 x16 CPU-to-GPU Interconnect
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System Memory
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Memory
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Slot Count: 8 DIMM slots/8 Channels
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Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
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View Memory Options
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Memory Voltage
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On-Board Devices
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SATA
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SATA (6Gbps) ; RAID 0/1/5/10 support
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NVMe
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NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
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View NVMe Options
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Network Connectivity
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2 RJ45 1GbE with Intel® I210
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View AOC Options
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Input / Output
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LAN
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2 RJ45 1 GbE LAN ports
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1 RJ45 1 GbE Dedicated BMC LAN port (IPMI shared on LAN port 1)
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USB
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2 USB 3.2 Gen1 Type-A ports(rear)
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2 USB 2.0 Type-A ports(rear)
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2 USB 3.2 Gen1 Type-A ports(front)
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1 USB 2.0 Type-A port(Header)
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Video
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Serial
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1 COM port(Rear)
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1 COM port(Header)
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TPM
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System BIOS
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BIOS Type
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AMI 32MB SPI Flash EEPROM
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Management
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Software
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Power configurations
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ACPI/APM Power Management
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Security
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Hardware
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Trusted Platform Module (TPM) 2.0
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Silicon Root of Trust (RoT) – NIST 800-193 Compliant
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Features
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Cryptographically Signed Firmware
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Secure Boot
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Secure Firmware Updates
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Automatic Firmware Recovery
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Supply Chain Security: Remote Attestation
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Runtime BMC Protections
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System Lockdown
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PC Health Monitoring
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CPU
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8 Phase-switching voltage regulator
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Monitors for CPU Cores, Chipset Voltages, Memory
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FAN
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Fans with tachometer monitoring
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Pulse Width Modulated (PWM) fan connectors
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Status monitor for speed control
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Temperature
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Monitoring for CPU and chassis environment
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Thermal Control for fan connectors
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Certifications
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Operating Systems
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Chassis
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Form Factor
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Model
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Dimensions and Weight
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Height
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Width
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Depth
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Package
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7.75" (H) x 23.5" (W) x 31.5" (D)
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Weight
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Gross Weight: 33.5 lbs (15.2 kg)
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Net Weight: 21 lbs (9.53 kg)
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Available Color
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Front Panel
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Buttons
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Power On/Off button
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Unit Identification (UID) button
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LED
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Fan Fail/System Over Heat LED
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HDD activity LED
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Network Activity LEDs
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Power status LED
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Expansion Slots
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PCI-Express (PCIe) Configuration
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Default
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2 PCIe 5.0 x16 FHFL slots
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1 PCIe 5.0 x8 (in x16) LP slot
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View AOC Options
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Drive Bays / Storage
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Drive Bays Configuration
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Default: Total 10 bays
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10 front hot-swap 2.5" NVMe*/SAS*/SATA drive bays
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(*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for details)
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View NVMe Options
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View Drive Options
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M.2
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System Cooling
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Fans
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Up to 5 middle cooling PWM 40x40x56mm Fan(s)
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Up to 1 AOC cooling Fan(s) (optional)
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Air Shroud
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Power Supply
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2x 860W Redundant (1 + 1) Titanium Level (96%) power supplies
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Dimension (WxHxL)
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54.5 x 40.25 x 322 mm
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Input
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800W: 100-127Vac / 50-60Hz
860W: 200-240Vac / 50-60Hz
860W: 240Vdc / 50-60Hz
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+12V
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Max: 66.67A / Min: 0A (100Vac-127Vac)
Max: 71.67A / Min: 0A (Vdc-240Vdc)
Max: 71.67A / Min: 0A (200Vac-240Vac)
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5V SB
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Max: 4A / Min: 0A
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Output Type
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Backplanes (gold finger)
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Operating Environment
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Environmental Spec.
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Operating Temperature: 10°C to 35°C (50°F to 95°F)
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Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
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Operating Relative Humidity: 8% to 80% (non-condensing)
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Non-operating Relative Humidity: 8% to 90% (non-condensing)
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For detailed specifications, options, and compatibility, please refer to the latest official Supermicro documentation and the actual quotes/specifications from Autech.
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Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 300W TDP
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Intel® C741 Chipset
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8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz
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Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN
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10x front hot-swap 2.5" SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
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Redundant Now Titanium 860W Power Supplies
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Virtualization
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Data Center Optimized
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Entry GPU server
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Cloud Computing
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Database/Storage
