• SYS-621C-TN12R
  • SYS-621C-TN12R
  • SYS-621C-TN12R
  • SYS-621C-TN12R
  • SYS-621C-TN12R
  • SYS-621C-TN12R

SYS-621C-TN12R

2U DP CloudDC with 12 hot-swap 3.5" NVMe/SAS/SATA bays and 4 PCIe 5.0 x16 slots + 2 PCIe 5.0 x16 AIOM slots
型号 : SYS-621C-TN12R

Product SKUs
SuperServer SYS-621C-TN12R
SuperServer SYS-621C-TN12R-02-G1 Gold Series version with pre-configured components
Motherboard
Super X13DDW-A
Processor
CPU
Core Count
  • Up to 64C/128T; Up to 112.5MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)*
  • *Air Cooled CPUs with TDP over 270W only supported under specific conditions. Contact a Supermicro representative for details.
GPU
Max GPU Count
  • Up to 2 double-width or 6 single-width GPUs
Supported GPU
  • NVIDIA PCIe: H100 NVL, H100, L40, RTX A6000, RTX A5000, RTX A4500, RTX A4000, L40S, L4, A2
  • Intel PCIe: Intel Data Center GPU Flex 140, Intel Data Center GPU Flex 170
  • View GPU Options
Certification
  • Nvidia Certified
System Memory
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
SATA
  • SATA (6Gbps) ; RAID 0/1/5/10 support
NVMe
Chipset
  • Intel® C741
Network Connectivity
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.2 Gen1 Type-A ports(rear)
Video
  • 1 VGA port
Serial
  • 1 COM port(rear)
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 32MB SPI FLASH ROM
Management
Software
Power configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 8 Phase-switching voltage regulator
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-LA26TS-R1K23AWP1
Dimensions and Weight
Height
  • 3.5" (89 mm)
Width
  • 17.2" (437 mm)
Depth
  • 25.5" (648 mm)
Package
  • 11.4" (H) x 26.7" (W) x 34.5" (D)
Weight
  • Gross Weight: 59 lbs (26.76 kg)
  • Net Weight: 33 lbs (15 kg)
Available Color
  • Black front & sliver body
Front Panel
LED
  • Drive activity
  • Network activity
  • Power status
  • Universal Information (UID)
Buttons
  • Power On/Off
  • Universal Information (UID)
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 4 PCIe 5.0 x8 (in x16) FHFL slots
    • 2 PCIe 5.0 x16 (in x16) FHHL slots
    • 2 PCIe 5.0 x16 (in x16) AIOM slots (OCP 3.0 compatible)
  • Option A
    • 2 PCIe 5.0 x16 (in x16) FHFL slots
    • 2 PCIe 5.0 x16 (in x16) FHHL slots
    • 2 PCIe 5.0 x16 (in x16) AIOM slots (OCP 3.0 compatible)
  • Option B
    • 4 PCIe 5.0 x16 (in x16) FHFL slots
    • 2 PCIe 5.0 x16 (in x16) FHHL slots
    • 2 PCIe 5.0 x16 (in x16) AIOM slots (OCP 3.0 compatible)
  • ...
  • View AOC Options
CXL Support
  • Up to 2 CXL 1.1 x16/x8 Type 2/Type 3 devices
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 12 bays
    • 12 front hot-swap 3.5" NVMe*/SAS*/SATA* drive bays
  • Option A: Total 12 bays
    • 12 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays
  • (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
  • View NVMe Options
  • View Drive Options
M.2
  • 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280(default); VROC required for RAID)
  • View M.2 Options
System Cooling
Fans
  • Up to 3x 8cm heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud
Power Supply
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Name: A2
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -30°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (max 21° DP; non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (max 38° DP; non-condensing)
  1. Dual sockets E (LGA-4677) 5th and 4th Gen Intel®  Xeon® Scalable processors
  2. 16 DIMMs up to 4TB 3DS ECC DDR5-5600: RDIMM
  3. 4 PCIe 5.0 x8 FHHL (optional: combine into 2 PCIe 5.0 x16);
    2 PCIe 5.0 x16 FHHL;
    2 PCIe 5.0 x4 NVMe M.2
  4. Dual AIOM (OCP 3.0) slots with NCSI for networking, 1 dedicated IPMI LAN
  5. 12x 3.5/2.5" hot-swap hybrid NVMe/SATA/SAS drive bays
  6. 3 heavy duty fans with optimal fan speed control, 1 air shroud
  7. 1200W redundant Titanium level 100-240Vac and 200-240 Vdc power supplies
  8. 1 VGA, 1 COM, 2 USB 3.0 (rear)

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