SYS-112C-TN

1U UP CloudDC with DC-MHS, up to 12 hot-swap 2.5" NVMe/SAS/SATA bays and 2 PCIe 5.0 x16 slots + 1 PCIe 5.0 x16 AIOM slot

型号 : SYS-112C-TN

数量 :

Product SKUs
SuperServer SYS-112C-TN

Motherboard
Super X14SBHM

Processor
CPU	Single Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores
Core Count	P-cores: Up to 86C/172T; Up to 336MB Cache E-cores: Up to 144C/144T; Up to 108MB Cache
Note	Supports up to 350W TDP CPUs (Air Cooled)

GPU
Max GPU Count	Up to 2 single-width GPUs
Supported GPU	NVIDIA PCIe: L4 View GPU Options
CPU-GPU Interconnect	PCIe 5.0 x16 CPU-to-GPU Interconnect

System Memory
Memory	Slot Count: 16 DIMM slots/8 Channels Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM Max Memory (1DPC): Up to 512GB 8000MT/s ECC DDR5 MRDIMM (P-core only) Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 RDIMM View Memory Options
Memory Voltage	1.1V

On-Board Devices
NVMe	NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) View NVMe Options
Chipset	System on Chip
Network Connectivity	Via AIOM View AIOM Options View AOC Options

Input / Output
LAN	1 RJ45 1 GbE Dedicated BMC LAN port (via DC-SCM)
USB	2 USB 3.2 Gen1 Type-A ports(Rear) (via DC-SCM)
Video	1 Mini-DP port(Rear) (via DC-SCM)
TPM	1 TPM header

System BIOS
BIOS Type	AMI 32MB SPI Flash EEPROM

Management
Software	SuperCloud Composer® Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations	ACPI/APM Power Management

Security
Hardware	Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features	Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown

PC Health Monitoring
CPU	Monitors for CPU Cores, Chipset Voltages, Memory
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment Thermal Control for fan connectors

Dimensions and Weight
Height	1.7" (43 mm)
Width	17.2" (437 mm)
Depth	29.4" (747 mm)
Package	8.1" (H) x 23.8" (W) x 40.6" (D)
Weight	Gross Weight: 47 lbs (21.3 kg) Net Weight: 31 lbs (14.1 kg)
Available Color	Black

Front Panel
LED	HDD activity LAN1 activity LAN2 activity Power Failed LED Power status System information
Buttons	Power On/Off button UID button

Expansion Slots
PCI-Express (PCIe) Configuration	Default 2 PCIe 5.0 x16 FHHL slots 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) View AOC Options

Drive Bays / Storage
Drive Bays Configuration	Default: Total 8 bays 8 front hot-swap 2.5" PCIe 5.0 x4 NVMe/SAS/SATA* drive bays Option A: Total 12 bays 8 front hot-swap 2.5" PCIe 5.0 x4 NVMe/SAS/SATA* drive bays 4 front hot-swap 2.5" SAS/SATA drive bays Option B: Total 12 bays 12 front hot-swap 2.5" PCIe 5.0 x4 NVMe/SAS/SATA* drive bays (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details) View NVMe Options View Drive Options
M.2	2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280(default)/22110; optional configuration) View M.2 Options

System Cooling
Fans	Up to 8 Counter-Rotating PWM 40x40x56mm Fan(s)
Air Shroud	1 CPU Air Shroud 1 M.2 Side Air Shroud

Power Supply

2x 1000W Redundant (1 + 1) Titanium Level (96%) power supplies

Dimension (WxHxL)	73.5 x 40 x 185 mm
Input	800W: 100-127Vac / 50-60Hz 1000W: 200-240Vac / 50-60Hz
+12V	Max: 66.7A (100Vac-127Vac) Max: A (100Vdc-240Vdc) Max: 83A (200Vac-240Vac)
12V SB	Max: 2.1A
Output Type	Backplanes (gold finger)
Certification	Titanium Level [ Test Report ]

Operating Environment
Environmental Spec.	Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing)

All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations
Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
Support DC-SCM module with OpenBMC
Single Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores
16 DIMM slots supporting DDR5 RDIMM(2DPC/1DPC) or MRDIMM(1DPC)
Support FH DPU and single slot GPU
Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible).
Breeze through high throughput workloads with PCIe 5.0 NVMe drive support
Trusted Platform Module (TPM) 2.0 9672 onboard